Sputtering Targets
Sputtering Targets
Sputtering targets are specialized materials employed for thin-film deposition in various industries, including electronics, energy, and textiles. These targets can be composed of different elemental or alloy compositions, such as pure metals or ceramics, and are bombarded by ions, causing atoms or molecules to be ejected from their surface. These particles then deposit on a substrate to create a thin, uniform film. Different types of sputtering targets exist, including planar or rotary targets and a range of materials, such as gold, silver, titanium, and tungsten. Their selection depends on different factors like the application requirements, material properties, and compatibility with the sputtering system.
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Sputterring aus Aluminium, 76.2 mm (3.0 Zoll) Durchmesser x 3.18 mm (0.125 Zoll) Dicke, 99.999 % (Metallbasis), Thermo Scientific Chemicals
CAS: 7429-90-5 Summenformel: Al Molekulargewicht (g/mol): 26.98 MDL-Nummer: MFCD00134029 InChI-Schlüssel: XAGFODPZIPBFFR-UHFFFAOYSA-N Synonym: aluminum,metal,powder,aluminio,metana,adom,alumina fibre,aluminum flake,dust,noral aluminum PubChem CID: 5359268 ChEBI: CHEBI:33629 IUPAC-Name: Aluminium SMILES: [Al]
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Sputterring aus Aluminium, 50.8 mm (2.0 Zoll) Durchmesser x 3.18 mm (0.125 Zoll) Dicke, 99.999 % (Metallbasis), Thermo Scientific Chemicals
CAS: 7429-90-5 Summenformel: Al Molekulargewicht (g/mol): 26.98 MDL-Nummer: MFCD00134029 InChI-Schlüssel: XAGFODPZIPBFFR-UHFFFAOYSA-N Synonym: aluminum,metal,powder,aluminio,metana,adom,alumina fibre,aluminum flake,dust,noral aluminum PubChem CID: 5359268 ChEBI: CHEBI:33629 IUPAC-Name: Aluminium SMILES: [Al]
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